THERMAL INTERFACE MATERIAL

New addition: Injectable Thermal Gel Pad

This is the newest addition to our thermal products.  Two gels come in separate container (syringe or can).   Mix the two gels in a syringe or use an automatic 2-liquid-mixing dispenser.  Once mixed, the gels cure into solid but soft and pliable "pad" like a regular thermal pad in less than 5 min. at 100 deg C, in 6.5 min at 85 deg C, or in 12 hrs. at room temperature.  Creative applications can save inventory cost by not having to inventory various die-cut size and thickness pads, and labor cost by being able to use an automatic dispenser.  It can be injected into a shielding can eliminating the air gap between the can interior and IC chips.  Once filled with the gel mixture, the shielding can doubles as a heat sink.  For more information, click here: 2-Liquid Thermal Gel Pad.

Thermal Interface Pad: is available in standard sheet sizes, die-cut pad, or tape rolls.

Silicone and alumina ratio is carefully adjusted to attain right therman conductivity, right hardness, and right compression force combination. 

Available conductivity = 1  W/mK (more economical) to 7 W/mK to meet your needs                                     Available thickness = 0.5 mm to 10 mm (or more as custom made)                                                               Hardness = soft Shore 00: 5 to firm but elastic Shore A: 90                                                                          Dielectric Strength = >6 kV to 28 kV                                                                                                                      RoHS compliant                                                                                                                                                   UL94 V0

Part number ending with "F" indicates pad with glass-fiber reinforcemnet. Part number ending with "P" indicates pad with thin PET reinforcement. THEA710F is a very popular thermal pad due to its highly soft composure which prevents unnecessary exersion of pressure on PCB.  These materials are available from 0.5mm to 10mm thicknesses, in standard size sheets or die-cut pieces. For details, please click on the part numbers below.

THEA708     = 0.8 W/mK thermal pad                                                                                                THEA708F   = 0.8 W/mK thermal pad,with fiber glass reinforcement
THEA710     = 1.0 W/mK thermal pad, ULTRA SOFT                                                                                           THEA710F   = 1.0 W/mK thermal pad,ULTRA SOFT, with fiber glass reinforcement
THEA710H   = 1.0 W/mK thermal pad, SOFT                                                                                         THEA710HG   = 1.0 W/mK thermal pad, SOFT, with fiber glass reinforcement                                                        THEA715      = 1.5 W/mK thermal pad                                                                                                THEA715F    = 1.5 W/mK thermal pad with fiber glass reinforcement
THEA720      = 2.0 W/mK thermal pad                                                                                                     THEA720F    = 2.0 W/mK thermal pad with fiber glass reinforcement
THEA730      = 3.0 W/mK thermal pad                                                                                                   THEA730F    = 3.0 W/mK thermal pad with fiber glass reinforcemet
THEA750      = 5.0 W/mK thermal pad
THEA750F    = 5.0 W/mK thermal pad with fiber glass reinforcemet
THEA770      = 7.0 W/mK thermal pad                                                                                                    THEA770F    = 7.0 W/mK thermal pad with fiber glass reinforcemet

Electrically Insulating Thermal Interface Material: has high dielectric strength.  Main application is for power transisters and thermisters.  It provides good electrical insulation, removes heat, and provides cushion to protect the component.

THEAH810        = thermally conductive electric insulator, 1.0 W/mK, Dielectric Strength 13 KV
THEAH812        = thermally conductive electric insulator, 1.12 W/mK, Dielectric Strength 12 KV
THEAH909F      = thermally conductive electric insulator, 0.9 W/mK, Dielectric Strength 20 KV
THEAH916F      = thermally conductive electric insulator, 1.6 W/mK, Dielectric Strength 20 KV
THEAI3014-09   = thermally conductive electric insulator, 0.9 W/mK, Dielectric Strength 25 KV
THEAI5014-13   = thermally conductive electric insulator, 1.3 W/mK, Dielectric Strength 28 KV

Thermal Adhesive / Thermal Grease: comes in dispenser syringes for easy and clean application.

Viscosity = 20 Pa-s to 65 Pa-s                                                                                                                       Thermal Conductivity = 1.8 W/mK to 4.1 WmK

THEA-E20       = thermally conductive silicone adhesive, 2.0 W/mK, viscosity 20 Pa-s (23C)                              THEA-G20       = thermally conductive silicone adhesive, 1.8 W/mK, viscosity 20 Pa-s (23C)                                 THEA-G65       = thermally conductive silicone adhesive, 2.4 W/mK, viscosity 65 Pa-s (23C)

THEA-P2100  = thermally conductive silicone grease, 2.1 W/mK, viscosity 250 Pa-s (23C)                               THEA-P4100  = thermally conductive silicone grease, 4.1 W/mK, viscosity 300 Pa-s (23C)